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The purchased manual is an high quality scan of the original Philips paper-based Service Manual. I am very satisfied!
The purchased manual is an scan of the original Panasonic paper-based Service Manual. Unfortunately the contrast is not perfect, but I am satisfied anyway!
The purchased manual is an high-quality scan of the original JVC paper-based Service Manual. The Service Manual includes the Owner´s Manual, so you do not have to buy both of them.
It paid to find this Service Manual, couldn't find it anywhere else. Exactly what I wanted. Received within 24 hours.
Complete manual with clear schematic diagrams and printed circuit board layouts of two variants of the headset and the transmitter an old and a new version.
Also shows how the headset and the transmitter is opened and how transmitter and receivers can be adjusted and where to measure.
I had no problems to repair the headset using this service manual.
REPLACEMENT OF CHIP COMPONENT
1. 2. 3. 4. Avoid heating for more than 3 seconds. Do not rub the electrodes and the resist parts of the pattern. When removing a chip part, melt the solder adequately. Do not reuse a chip part after removing it.
a SOLDERING IRON
1. Use a high insulation soldering iron with a thin pointed end of it. 2. A 30w soldering iron is recommended for easily removing parts.
a REPLACEMENT STEPS
1. How to remove Chip parts
Resistors, capacitors, etc. (1) As shown in the figure, push the part with tweezers and alternately melt the solder at each end.
2. How to install Chip parts
Resistors, capacitors, etc. (1) Apply solder to the pattern as indicated in the figure.
(2) Grasp the chip part with tweezers and place it on the solder. Then heat and melt the solder at both ends of the chip part. (2) Shift with tweezers and remove the chip part.
Transistors, diodes, variable resistors, etc. (1) Apply extra solder to each lead.
Transistors, diodes, variable resistors, etc. (1) Apply solder to the pattern as indicated in the figure. (2) Grasp the chip part with tweezers and place it on the solder. (3) First solder lead A as indicated in the figure.
(2) As shown in the figure, push the part with tweezers and alternately melt the solder at each lead. Shift and remove the chip part.
(4) Then solder leads B and C.
A B C
Note : After removing the part, remove remaining solder from the pattern.