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Complete manual with clear schematic diagrams and printed circuit board layouts of two variants of the headset and the transmitter an old and a new version.
Also shows how the headset and the transmitter is opened and how transmitter and receivers can be adjusted and where to measure.
I had no problems to repair the headset using this service manual.
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Excellent printing quality. A complete and very useful manual with all details.
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This is a great site. I placed my order and by the next am it was available for download. Had some problems with some missing copy on some pages. Once I brought the error to the OMC's attention, the issue was resolved. I'll come back again.
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Mi spiace per non poter scrivere in inglese... ma sono veramente soddisfatto del servizio offerto. Grazie..!!
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The quality of this manual is good. It has all schematics and setup information for both the MDS-B3 and the MDS-B4. The scan quality is quite good, all pages are readable, This service manual also contains scans of the operating instructions from the User manual.
3.3.6 Removing the amp. board (See Fig.10) � Prior to performing the following procedures, remove the amplifier assembly, rear panel, heat sink BKT and mother board. (1) From the left side of the amplifier assembly, remove the nine screws J attaching the amp. board. (2) Take out the amp. board with the heat sink.
Amp. board
Heat sink
J
Fig.10 3.3.7 Removing the heat sink (See Figs.11 and 12) � Prior to performing the following procedures, remove the amplifier assembly, rear panel, heat sink BKT, mother board and amp. board. (1) From left side of the amp. board, remove the screw K attaching the hold spring to the heat sink. (See Fig.11.) (2) Remove the four screws L attaching the power IC to the heat sink. (See Fig.11.) (3) From the reverse side of the amp. board, remove the three screws M attaching the heat sink to the amp. board. (See Fig.12.) (4) Take out the heat sink. 3.3.8 Removing the power IC (See Fig. 12) � Prior to performing the following procedures, remove the amplifier assembly, rear panel, heat sink BKT, mother board, amp. board and heat sink. (1) From the reverse side of the amp. board, remove the solders from the solder points a on the amp. board. (2) Take out the power IC.
Heat sink
Power IC
Amp. board
L
Hold spring
Fig.11
L K
Amp. board
Solder points a
M
Fig.12
1-22 (No.MB236)
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